| PART |
Description |
Maker |
| SSHS-6-D |
.050*.100 cl Dual Row - Straight Socket Strips
|
Major League Electronics
|
| BSTS-6-D |
.050*.100 cl Dual Row - Straight Board Stacker Terminal Strips
|
Major League Electronics
|
| BSTCM-6-DV |
.050*.100 cl Dual Row - Surface Mount - Vertical Board Stacker Terminal Strip Headers
|
Major League Electronics
|
| TSHSCM-5-DV |
.050x.050 cl Dual Row - Surface Mount Terminal Strip Headers - Vertical - Custom
|
Major League Electronics
|
| 533170-5 |
.050, .075, .100 Box Connectors; 2 ROW BOX RECP ASSY 64 POSN ( AMP )
|
Tyco Electronics
|
| 0702800458 70280-0458 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail
|
Molex Electronics Ltd.
|
| 0781206013 78120-6013 |
1.27mm (.050) Pitch Wire-to-Board Receptacle, Dual Row, Vertical, SMT, 0.25um (10u) Gold (Au) Plating
MOLEX Connector
|
http://
Molex Electronics Ltd.
|
| 0879331007 87933-1007 |
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 10 Circuits, 0.05μm (2μ) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 10 Circuits, 0.05渭m (2渭) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap
|
http://
Molex Electronics Ltd.
|
| 0702800448 70280-0448 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, Tin (Sn) Plating, 2.72mm (.107) PC Tail Length
MOLEX Connector
|
Molex Electronics Ltd.
|
| 87914-2216 0879142216 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
|
